Thermal Heatsink Compound Cooling Paste Grease Syringe for PC CPU TG-S808 20g

Description

Specification:
Thermal Conductivity: 8 W/mK
Oil Dispersible: <0.1 wt%
Density: 3.2 g/cm³
Working Temperature: -40~200°C
Volume Resistance: >10^13
*TG-N909/TG-S808 has a shelf-life of eighteen (18) months from the date of manufacture, as indicated by the lot number, when stored in the original, unopened contained at, or below 25°C.
Application:
Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.
Features:
High thermal conductivity
Good leveling agent
No overflow
Effectively fill the gap of the interface
Low thermal impedance/thermal resistanceSilicone base, no Environmental pollution
Storage:
Store in a cool, dry place away from direct sunlight.